A Model for the Diffusion of Moisture in Adhesive Joints. Part III: Numerical Simulations

S. Roy; D. R. Lefebvre; D. A. Dillard; J. N. Reddy

doi:10.1080/00218468908050592

A Model for the Diffusion of Moisture in Adhesive Joints. Part III: Numerical Simulations

S. Roy, D. R. Lefebvre, D. A. Dillard, J. N. Reddy

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	41-62
Number of pages	22
Journal	The Journal of Adhesion
Volume	27
Issue number	1
DOIs	https://doi.org/10.1080/00218468908050592
State	Published - 1989
Externally published	Yes

ASJC Scopus Subject Areas

General Chemistry
Mechanics of Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Materials Chemistry

Keywords

butt joint
Durability
finite element analysis
strain
stress
viscoelasticity

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10.1080/00218468908050592

Cite this

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journal = "The Journal of Adhesion",

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AU - Dillard, D. A.

AU - Reddy, J. N.

PY - 1989

Y1 - 1989

KW - butt joint

KW - Durability

KW - finite element analysis

KW - strain

KW - stress

KW - viscoelasticity

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JO - The Journal of Adhesion

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A Model for the Diffusion of Moisture in Adhesive Joints. Part III: Numerical Simulations

ASJC Scopus Subject Areas

Keywords

Access to Document

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