Effect of moisture diffusion on stress distributions in adhesive joints

S. Roy, J. N. Reddy

Research output: Contribution to conference › Paper › peer-review

Original language	English
Pages	17-21
Number of pages	5
State	Published - 1988
Externally published	Yes
Event	Advances in Adhesively Bonded Joints - Chicago, IL, USA Duration: Nov 27 1988 → Dec 2 1988

Conference	Advances in Adhesively Bonded Joints
City	Chicago, IL, USA
Period	11/27/88 → 12/2/88

ASJC Scopus Subject Areas

TY - CONF

T1 - Effect of moisture diffusion on stress distributions in adhesive joints

AU - Roy, S.

AU - Reddy, J. N.

PY - 1988

Y1 - 1988

UR - http://www.scopus.com/inward/record.url?scp=0024128731&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0024128731&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0024128731

SP - 17

EP - 21

T2 - Advances in Adhesively Bonded Joints

Y2 - 27 November 1988 through 2 December 1988

ER -